In the closing stages, Calibre 3DStress performs rigorous sign-off analysis, ensuring that all assembly elements meet ...

Mechanical stress can affect the full automotive system and must be considered starting at the IC design and verification stage. Summary. The automotive industry is increasingly adopting 3D-ICs to ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

Tool changing 3D printers are hot. The idea is that instead of switching filament, you swap out hot ends or other tools. That isn’t a new idea. However, most tool changers are expensive. [Eng… ...

Dalian University of Technology researchers advance flexible circuits using 3D printing - producing freestanding 3D ...

Accurate thermal analysis, performed throughout the design flow from early 3D floorplanning to final chip signoff, is crucial for capturing die-die and die-package thermal hotspots that can affect ...