The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports ... TrendForce notes that the adoption of hybrid bonding could lead to significant shifts in the HBM business model. It becomes critical to ...

GENEVA, Ohio--(BUSINESS WIRE)--The TEGAM Model R1L-E2A Ground Bond Meter is unique in that it not only provides accurate low-resistance measurements, but is also intrinsically safe. This makes the ...

TOKYO -- Gold has long been the favorite for the all-important bonding wire in semiconductor chips, but copper is fast replacing the precious metal as gold prices soar and semiconductor making ...