And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package ... like chip on board electronics which ...

Given the length of the leads and the width of the plastic package, we could come up with a good estimate of the “wingspan” for our flattened chip ... that’s what the board house is going ...

The film is moved to the target location, and the leads are cut and soldered to the board. Also called a "tape carrier package" (TCP), the bare chip is then encapsulated ("glob topped") with epoxy ...

These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter ...