13. Guideline for Measurement of Electronic Package Inductance and Capacitance Model Parameters, ” JEDEC Publication #123, JC-15 Committee, October 1995 14. D.A. Smolyansky, TDR Techniques for ...

Making “lookalike” parts that resemble real ones takes very little skill. It simply requires finding cheap parts in the same format of package and merely painting new marks on them.

JEDEC has published a new release of the JEP30 Part Model Guidelines, including reference documents and related XML Schema files. ... In prospect, it suggests, is the possibility of automating System ...

When the parts.io electronic component search engine was opened up for public use we covered it and gave you the rundown. ... package type, and pin counts, ...

Toshiba Electronic Devices & Storage Corporation: a new three-phase brushless fan motor driver "TB67B000FG" for air conditioners, air purifiers and other home appliances, and for industrial equipment.

Engineers develop unique electronics pacakge for missile systems to support various aviation platforms. Research center engineers develop electronics package By Heather R. Smith, AMRDEC Public ...