The ability to conduct system-level co-design of the chip and package makes it possible to optimize bump and ball placement, I/O placement and pin assignment to lower chip, package and PCB layer ...

Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

3 thoughts on “ IPhone 6S NVMe Chip Tapped Using A Flexible PCB ” Maave says: March 4, 2024 at 6:06 am Dang that’s cool. I like this new era of MitM flex cables. Report ...

Even though America invented and led the world in PCB technology, our share of worldwide PCB production shrank from 30% to 4% of the world’s supply over 30 years. In the same period, the number ...

0 comments on “ Successful PCB grounding with mixed-signal chips – Part 2: Design to minimize signal-path crosstalk ” Leave a Reply Cancel reply. You must Sign in or Register to post a comment. Post ...

“The problems people started to face were twofold. One was that the bandwidth between these chips was limited by going through the PCB, and then a limited number of balls on the package limited the ...

Today, we revisit another board from [Exentio] – a HDMI/DVI to LVDS transmitter for the Sony Vaio P display. This board is cool to review – it has a high-speed serial interface, a paral… ...

Taiwan's PCB and semiconductor equipment manufacturers are poised to enhance their footprint in Southeast Asia by establishing manufacturing operations or bolstering their customer base in the region.