A Wafer-Scale LLM Inference System” was published by researchers at University of Edinburgh and Microsoft Research. Abstract ...

What is voltage droop, how to measure it, and is your mitigation system sufficient?

Researchers from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Laboratory (PPPL) investigated ways to speed up the cryogenic reactive ion etching process for 3D NAND ...

Industry growth reports; new GF CEO; UVM for mixed signal; power demands explode; EU-US chip collaboration; earnings; S Korea ...

Smart watches, rings, and a growing array of patches are adding more functionality and being used across a growing set of ...

New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are ...

A  new technical paper titled “Accelerating OTA Circuit Design: Transistor Sizing Based on a Transformer Model and ...

OEMs and suppliers are beginning to move in lock-step, linking software design with chip development to speed time to market, ...

AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...

One example of a design analysis tool that can be particularly valuable for automotive IC designers is Insight Analyzer from ...

Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia Tech. Abstract: “3D heterogeneous ...

Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.