Since miniaturization of electronic devices makes the joint height of solder joints shrink to tens of microns. IMCs take noticeably high volume ratio in solder joints, which seldom happens in BGA or ...

Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised surface mount components in consumer electronics which operates in high-temperature ambient is studied.

However, current research on the specific differences among these techniques in terms of multi-joint coordination and muscle synergy is limited. This study investigates the effects of these three ...