This paper proposes an autonomous landing scheme for a small-scale flybarless helicopter equipped with low-cost navigation sensors. The main contribution of this paper is the design of a model-free ...

Through the support excitation scheme, transient structural responses of a board-level chip-scale package subjected to the JEDEC drop test are analyzed using the implicit three-dimensional finite ...

Beck, A.T. and Steer, R.A. (1993) Manual for the beck hopelessness scale. The Psychological Corporation, San Antonio.

The high cost and low reproducibility issues of Si as the anode material for lithium-ion batteries still need to be addressed. Herein, we present a facile and scalable bead-grinding technique to ...

San Francisco-based SuperDial has raised $15 million in debt and equity funding to scale its AI platform, which automates administrative phone calls between providers and insurers. The series A ...

Abstract: Smart devices nowadays require more functionality in the integrated circuits with smaller packages. Wafer Level Chip Scale Package (WLCSP) is one of a best choice in the industry due to ...