Regardless of substrate stiffness, all three systems (HDPE, OBC, and PVDF) exhibited a similar trend in electromechanical behavior across a strain range extending to measured resistance values of 2 MΩ ...

SEMI 3D & Systems Summit to Highlight Heterogeneous Integration as Key to Europe's Semiconductor Resilience The SEMI 3D & Systems Summit, taking place June 25-27, 2025 in Dresden, will showcase the ...

INTRODUCTION The indirect bonding technique has been associated with the orthodontic digital system. With the assistance of software programs, clinicians can digitally position brackets precisely, ...