Environmental stress cracking in high-density polyethylene (HDPE) pipes is a critical phenomenon that undermines the structural integrity and service life of essential infrastructure systems.

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This paper presents a system-in-package (SiP) with Cu-plate bonding for voltage regulators. The SiP reduces the power loss by 23% and the thermal resistance by 44% compared to those of a SiP with wire ...

So, to achieve value engineering in structural waterproofing, consideration should be given to product, Product performance characteristics, installation, future maintenance and worst-case scenario, ...

Regardless of substrate stiffness, all three systems (HDPE, OBC, and PVDF) exhibited a similar trend in electromechanical behavior across a strain range extending to measured resistance values of 2 MΩ ...

SEMI 3D & Systems Summit to Highlight Heterogeneous Integration as Key to Europe's Semiconductor Resilience The SEMI 3D & Systems Summit, taking place June 25-27, 2025 in Dresden, will showcase the ...

With the help of temporary carriers, W2W bonding technology can greatly enhance HBM product density and thin profiles. It will also be possible to separate the fabrication of a traditional memory ...

This study aimed at investigating the effect of a methacrylate-modified chitosan on the durability of adhesive interfaces to improve the clinical performance of dental restorations. Chitosan was ...