Chip-Package-Board Issues Grow Success will depend on new tools, a better understanding of who's responsible, and new methodologies for getting designs out the door more quickly.

The theme of Track 4 of this year’s DesignCon conference is System Co-Design Chip/Package/Board Modeling & Simulation and it covers a broad range of topics addressing design-oriented modeling ...

Samsung LED Small LES Chip-on-Board Package - LC040C (Photo: Business Wire) Full Size. Small. Preview. Thumbnail. Small. Preview. Thumbnail. June 10, 2015 10:45 PM Eastern Daylight Time.

Determining the best package for each product is a significant challenge. Suppose a processor needs to work with memory devices provided by multiple vendors, each with their own pin-out. Determining ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before ...

Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...

The electronics maker unveils a chip package for cell phones that can hold up to nine chips, which the company says will give manufacturers greater flexibility when building handhelds.

Flip chip middle power LED package (LM131A) and high power LED package (LH141A) Samsung’s LM131A and LH141A flip chip packages feature exceptionally compact form factors of 1.22x1.22 millimeters ...

What's the point of having the hottest high-performance chip available when it doesn't fit on the board? We've all heard horror stories about chips not meeting timing closure ...

Curious also whether you have to supply an external flash chip for the fpga bitstream, or if that’s on board or on chip. 20 pin form is nice, but in most vintage h/w the most complex 20 pin ...

The Chip Pro is built around the GR8, a 32-bit 1GHz system-on-a-chip that’s manufactured by Allwinner. It’s fitted with an ARM Mali-400 GPU with RAM included in the processor package ...

Toshiba has unveiled a chip package for cell phones that can hold up to nine chips, which the company says will give manufacturers greater flexibility when building handhelds. The multichip ...