Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

An investigation of flip-chip package interconnection over a wideband frequency up to 100GHz is presented in this paper. Different packages are modeled and simulated to determine the electromagnetic ...

Microsoft's next-generation Maia AI chip is facing a delay of at least six months, pushing its mass production to 2026 from 2025, The Information reported on Friday, citing three people involved ...

Chip-package co-simulation is required to predict the interaction between the chip and package at the system level. The FDTD method can be used to analyze these structures but is limited by the ...

Five takeaways from newly released Micron chip project impact report Updated: Jun. 26, 2025, 4:51 p.m. | Published: Jun. 25, 2025, 10:17 a.m.

Calibre 3DStress for package verification Calibre 3DStress—the second part of Siemens EDA’s solution to streamline the design and analysis of complex, heterogeneously integrated 3D ICs—supports ...

Huawei Technologies' new MateBook Fold laptop is powered by an older-generation chip made by SMIC , highlighting how U.S. export curbs are hindering China's top foundry from advancing to next ...

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.