Embedded active technology, in which thinned active chips are directly buried into a core or high-density-interconnect layers, is gaining more interest for ultra-miniaturization, increased ...

We investigated a chip-package-PCB co-simulation method for power integrity design at the early design stage. Due to the number of design parameters that need to be surveyed to optimize power ...

The main reasons integrated circuit packages changed were the need for more connections, smaller sizes for mobile devices, and better cost and performance. As chips got more complex, the integrated ...