Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

NAND flash manufacturers have been implementing production cuts, leading to urgent orders to surge and leaving a supply ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

As electronic devices become more advanced, integrating complex logic into a single component becomes essential. Enter AND6, ...

This paper presents a hybrid all-NMOS rectifier with two gate-biasing techniques to extend the power dynamic range (PDR) for wireless power transfer. The proposed hybrid rectifier combines the ...