The semiconductor substrates are connected to a mainboard through solder balls that allow the exchange of electrical signals.

Instead of placing solder balls directly on the semiconductor substrate, smaller solder balls were mounted on top of 'Copper Posts' attached to the semiconductor substrate (see provided diagrams).

Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, that’s starting to be mass-produced.

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

Unlike conventional methods, where solder balls connect chip substrates directly to the mainboard, the Cu-Post method leverages copper pillars to reduce the pitch and size of solder balls.

LG Innotek said Wednesday it has developed a next-generation semiconductor substrate technology that can reduce smartphone thickness while improving heat dissipation — a longstanding challenge ...

This paper investigates the water film buildup on solder masked printed circuit board assembly (PCBA) laminates under humid conditions. The effects of solder mask surface chemistry, morphology, and ...

LG Innotek is continuing its quest to become the world's top company in the field of technology components, with its latest milestone being the successful development of an innovative semiconductor ...

New and emerging technologies such as e-mobility have a demand for higher power density, increased heat dissipation and higher reliability. The switch from Si die to SiC die to meet this requirement ...