Prior work has demonstrated a new process utilizing room-temperature liquid metal, Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible bond between chips ...

In this letter, a novel transition between a rectangular waveguide and coupled microstrip lines is presented. A differential microstrip patch antenna (DMPA) inside the waveguide acts as a radiation ...

CAG establishes separate unit for auditing state PSUs, enhancing efficiency and embracing digital transformation for remote auditing.