Siemens EDA is developing models for the aging of complex chip packages over time as part of its Calibre 3D tools to create digital twins up to the rack level.

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

System-level test (SLT) has evolved into a necessary test insertion for high-performance processors and chiplets.

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...

Broadcom was an early proponent of the tech, but in the past few months, its name has disappeared from the UALink Consortium website, and it's begun talking up its own scale-up Ethernet (SUE) stack, ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging ...

Apple poaches Apple's leader in AI in a huge multi-million dollar deal, putting another dagger into the failing Apple ...

As Snell notes, Apple’s A18 Pro chip is “46% faster than the M1 in single-core tasks, and almost identical to the M1 on multi ...

IBM is seeking a long-term partnership with Japan's Rapidus to develop sub-1nm chips, according to . Building on their 2nm ...

International Business Machines on Tuesday announced a new line of data center chips and servers that it says will be more ...

This is because modern robotic vision, including visual place recognition, typically relies on power-hungry machine learning ...