Seoul, Korea—Samsung Electronics Co. Ltd. has started to ship what it claims is the industry's first multi-chip package (MCP) with phase-change random access memory (PRAM) for use in mobile handsets ...

LONDON STMicroelectronics NV has said it has subsystems based on NOR flash memory intended for use in mobile phones. The multi-chip packages (MCPs) combine ST’s monolithic 256- and 512-Mbit NOR flash ...

Samsung has unveiled what it claims to be the industry's first multi-chip package using PRAM chips for mobile phones. Samsung reports that it is set to start using the new chip in handsets later ...

Bonding Issues For Multi-Chip Packages. Disaggregation solves some problems, but it creates new ones. November 19th, 2020 - By: Katherine Derbyshire. The rising cost and complexity of developing chips ...

Congress has passed a bill that will invest more than $200 billion over the next five years to help the US regain a leading position in semiconductor chip manufacturing. Here's what is in the ...

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Another tool for electromagnetic antennas and radar, is now needed inside of the package for 3D-IC to handle electromagnetic interference.” A problem with timescales Heat, thermal, and stress happen ...

WASHINGTON — Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.

$52.7 billion for chip manufacturing and research. The package will invest $39 billion over five years to expand domestic semiconductor manufacturing.

WASHINGTON — Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.

WASHINGTON — Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.