Siemens Digital Industries Software announced today Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations of the traditionally serial ...
MIPI contributor member company Velinktech recently announced that its high-speed automotive SerDes chipset has entered mass production in the 06 Relive compact SUV model by Lynk & Co, a global ...
EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applicat ...
Company will demonstrate newest LDOs, PLLs, and sensors proven on TSMC’s latest process technologies at the TSMC 2025 Open Innovation Platform® (OIP) Ecosystem Forum in Silicon Valley High accuracy ...
Backed by a comprehensive software ecosystem—including SDKs, unified GCC/LLVM-based toolchains, and IDEs—this RISC-V IP Cores portfolio enables rapid development and deployment across a wide range of ...
A modern approach applies artificial intelligence to accident reconstruction by mining large-scale accident databases ...
Jean-Marc Chery, STMicroelectronics President and CEO, gave a keynote speech at IAA Mobility 2025 on STs views on the automotive industrys deep transformation and our contribution, as a ...
Nvidia has announced that it is to invest $5 billion in Intel, just a few weeks after the White House itself negotiated a massive stake in the company. Consequently, Nvidia is now one of Intel's ...
The highly successful nRF54L Series continues to grow with the addition of the nRF54LM20A, offering developers more resources and flexibility to build advanced connected products across consumer, ...
EMASS, a subsidiary of Nanoveu, has introduced the ECS-DoT, a 22nm microprocessor designed to bring milliWatt-scale intelligence directly to edge and IoT device ...
EPI Forum will be held in magnificent Paris, at the L’Hôtel des Arts & Métiers, 9bis Avenue d’Iéna, 75016 Paris, France. The Forum will be organized in two days: the event starts on Oct 6 in the ...
AI and high-performance computing (HPC) workloads are growing steadily, and the need for establishing high performance and low-latency interconnect links is placing pressure on interconnect technology ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback