News
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and ...
With the end of Dennard scaling, three dimensional stacking has emerged as a promising integration technique to improve microprocessor performance. In this paper we present a 3D-SIC physical design ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results