OKI’s proprietary heterogeneous material bonding technology involving lifting off crystal films and bonding them to substrates or wafers made of different materials.

Microsembly upgrades its RF/microwave assembly with advanced wire bonding and die attach tools to support mission-critical manufacturing needs.

Mastering VLAN trunking, interface bonding, and QoS not only enhances the reliability of your network but also enables efficient resource allocation and traffic control.

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

The "big three" in the DRAM industry are preparing to end production of DDR3 and DDR4 memory solutions this year. Samsung Electronics, SK Hynix, and Micron are ...

Ball bonding, ideal for high-density applications, uses a small gold ball formed at the end of the wire, while wedge bonding, more suitable for aluminium wire, uses ultrasonic energy to create a ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...