SAN JOSE, Calif., May 7, 2025 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its ...

The new DRAM cell design is a two-transistor, no-capacitor (2t0c) design that utilises two thin-film transistors, each with an IGZO channel, to store data. The IGZO material is chosen for its wide ...

Today, Tecate offers ultracapacitor cells, lithium-ion capacitor cells, standard modules, and custom module design and manufacturing services. Other product offerings include audio assemblies and ...

These 3D trench capacitor structures are used in today’s DRAM capacitors and can achieve much higher capacitance per unit footprint compared to planar capacitors, allowing greater miniaturization and ...

How does DRAM work? But even though the 1 transistor 1 capacitor structure is very simple, DRAM had its teething troubles. In fact, the first five DRAM generations that Intel introduced had a very low ...

DRAM vs SRAM There are two main classifications of primary memory — DRAM (Dynamic Random Access Memory) and SRAM (Static Random Access Memory). While we have learned what DRAM is and how it works, how ...

In this work, we demonstrated capacitor-less 4F2 2-terminal InGaAs npn junction DRAM through careful device design. Using epitaxially grown InGaAs which have a steep junction, fabricated InGaAs ...

Researchers developed a new capacitorless DRAM technology that eliminates the need for a cell capacitor, increases memory density via 3D stacking of vertical transistors, and was tested through ...

In this work, we demonstrated capacitor-less 4F2 2-terminal InGaAs npn junction DRAM through careful device design. Using epitaxially grown InGaAs which have a ...