Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

As electronic devices become more advanced, integrating complex logic into a single component becomes essential. Enter AND6, ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

NAND flash manufacturers have been implementing production cuts, leading to urgent orders to surge and leaving a supply ...

Micron AWT improves the write performance of QLC NAND by delivering an industry-first multi-tiered SLC, TLC and QLC dynamic caching architecture to improve sequential write speeds. Improved write ...

The oversupply of NAND flash has forced memory chipmakers to implement production cuts in response to lower-than-expected orders from PC and smartphone manufacturers. Major players in the ...

Samsung Electronics has successfully completed the development of its groundbreaking 400-layer NAND technology, prepares for mass production.

Samsung's 9th-generation 280-layer V-NAND flash memory has only recently entered mass production, with the first commercial products expected to hit store shelves next year. However, according to ...

This paper presents an NMOS digital low-dropout regulator (LDO) with fast transient response and ultra-low quiescent current, to provide a tunable power supply for near-threshold voltage computing ...

NAND flash memory is a type of non-volatile memory that is primarily used for data storage. It derives its name from the Boolean logic gate "AND," and its architecture reflects this, with memory cells ...