News
Recently, Ag and Cu sinter paste joining is a proven bonding technology for SiC power modules application with a good thermal conductivity and which can be performed in low-temperature low-pressure.
In this article, an air discharge experimental platform is built and an air streamer discharge simulation model is constructed. The uniform electric field air streamer discharge at low temperature and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results