In the closing stages, Calibre 3DStress performs rigorous sign-off analysis, ensuring that all assembly elements meet ...

System-level test (SLT) has evolved into a necessary test insertion for high-performance processors and chiplets.

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...

deep dive Amazon Web Services (AWS) is in the process of building out a massive supercomputing cluster containing "hundreds ...

Apple poaches Apple's leader in AI in a huge multi-million dollar deal, putting another dagger into the failing Apple ...

Amazon is considering further investment in Anthropic to remain one of its top shareholders, ahead of Google, which has ...

Though the process of designing a chip using open-source tools may seem daunting at first, it’s an invaluable learning ...

International Business Machines on Tuesday announced a new line of data center chips and servers that it says will be more ...

April 17, 2025: OpenAI has released o3 and 04-mini, two reasoning AI models designed to be extra good at programming, math, ...

Samsung Galaxy Z Flip 7 FE combines foldable innovation with affordability. Discover its specs, Exynos 2400 chip, and release ...

Samsung's new Galaxy Z Fold 7, Z Flip 7, and Z Flip 7 FE have sharper cameras, more powerful multitasking software, and ...

Samsung has unveiled the Galaxy Z Fold 7. This premium foldable phone brings significant hardware upgrades and design refinements compared to last year's ...