Yole Group unveils the 2025 edition of its Power SiC: Market & Applications report, delivering a deep dive into SiC's evolving global landscape, covering device markets, supply ...

Agileo Automation announced the future expansion of its A²ECF-SEMI automation framework to include SEMI's EDA (Equipment Data Acquisition) standards suite. This ... Agileo Automation ...

CEA-Leti and Soitec announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator ... Semiconductor ...

Syensqo has introduced the market's first peroxide-curable FFKM polymers made entirely without fluorosurfactants from the PFAs family of chemicals, using its proprietary ...

Semiconductor Packaging News - Exclusive: Univ. of Michigan Research Study Demonstrates Novel Synthesis Using Veeco's Fiji ALD System ...

WIN Semiconductors Corp announces the launch of its NP12-1B, a groundbreaking 0.12 μm gate-length depletion-mode (D-mode) Gallium Nitride (GaN) High Electron Mobility ...

RECIF Technologies is pleased to announce the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, ... RECIF Technologies ...

Imec has set a new benchmark in RF transistor performance for mobile applications. They present a gallium nitride (GaN) MOSHEMT on silicon (Si) that achieves both record ... This week at the 2025 ...

Aehr Test Systems announced that President and CEO Gayn Erickson and CFO Chris Siu will be presenting at the William Blair 45th Annual Growth Stock Conference ...

Mycronic's Global Technologies division has acquired Surfx Technologies, providing atmospheric plasma solutions for surface treatment, including cleaning and active oxide ...

Polymer film fabrication is an essential process in various industries, from food packaging to battery production. The demand for precise, high-quality films is on the rise ...

Deca Technologies announced the signing of an agreement with IBM to implement Deca's M-Series™ and Adaptive Patterning® technologies in IBM's advanced packaging ...